聯發科技 MT7682S 是高度整合的系統單晶片,包含一個微控制器,低功耗 1T1R 802.11n 2.4GHz Wi-Fi 子系統,以及 PMU。微控制器為ARM Cortex-M4處理器,支援浮點運算,並且整合 1MB 快閃記憶體。請查看比較表格以了解不同智慧家庭晶片間的差異。


  • 高度整合的射頻 + 微控制器 + 記憶體

  • 低功耗的 RTC 模式

  • 主要應用:智能家電、家庭自動化、智能裝置、物聯網橋接器、連接多重雲端服務

Wi-Fi 子系統支持 1T1R 802.11b/g/n 無線協定、基帶和 MAC,含有一個可以完全卸載微控制器運算負擔的網路處理器,旨在滿足低功耗和高輸送量的應用程式。

MT7682 支援許多週邊介面,包括 UART、I2C、SPI、I2S、PWM、SDIO 和 ADC。

MT7682S chipset block diagram


  • IEEE 802.11 b/g/n (2.4GHz, 1x1)

  • Supports 20MHz, 40MHz bandwidth in 2.4GHz band

  • Wi-Fi security WEP/WPA2/WPS

  • SoftAP, sniffer

  • Dynamically switching between STA and SoftAP modes at runtime

  • MediaTek smart connection

  • Multi-cloud connectivity

  • Receiver antenna diversity

  • Integrated Balun, PA/LNA

  • Optional external LNA and PA support

Microcontroller subsystem

  • 192MHz ARM® Cortex®-M4 with FPU

  • 14 DMA channels

  • 1 RTC timer, 1 64-bit and 5 32-bit general purpose timers

  • Hardware DFS from 3MHz to 192MHz

  • Development support: SWD, JTAG

  • Crypto engine including AES, DES, MD5 and SHA-1/224/256/384/512

  • True random number generator

  • JTAG password protection


  • Up to 384KB SRAM, with zero-wait state and 96MHz maximum frequency

  • Up to 32KB L1 cache, with high hit rate, zero- wait state and 192MHz maximum frequency

  • Embedded 8Mbits flash, with less than 0.1μA (typical) and 80MHz maximum frequency deep power-down current

Communication interfaces

  • 1 SDIO 2.0 master and 1 SDIO 2.0 slave

  • 1 I2C (3.4Mbps) interface

  • 3 UARTs (3Mbps and with hardware flow control)

  • 1 SPI master and 1 SPI slave (both SCKs are up to 48MHz, quad mode)

  • 2 I2S interfaces

  • 5 PWM channels

  • 14 GPIOs (fast IOs, 5V-tolerant)

  • 1 channel 12-bit AUXADC

Power management

  • Integrated DC-DC
  • Power input
    • VRTC: from 1.62V to 3.63V
    • VPMU / VRF: 3.3V (+/-10%)
    • VIO*: 1.8V/2.8V/3.3V (+/-10%)
  • Off mode: <0.5μA
  • Retention mode (with RTC)
    • <2μA (RTC only)
    • ~4.4μA with 8KB RAM sleep mode
  • Deep sleep mode (with external 32kHz clock)
    • 57μA with 0KB RAM sleep mode
    • 89μA with 384KB RAM sleep mode
  • G-band RX power: 59 mA
  • G-band TX power
    • FPA:268 mA at 19 dBm CCK
    • HPA: 203 mA at 16.5 dBm OFDM
  • DTIM interval with 32kHz external clock source and 384KB SRAM
    • DTIM=1: 0.74mA
    • DTIM=3: 0.33mA
  • Ambient temperature from -40°C to 85°C

Note: The power consumption data is measured at 25°C

Clock source

  • 26MHz or 40MHz crystal oscillator

  • 32kHz crystal oscillator or internal 32kHz RC for RTC


  • 5mm x 5mm x 0.9mm 40-pin QFN with 0.4mm lead pitch