MT7682

Overview

联发科技 MT7682S 是高度集成的系统单芯片，包含一个单片机，低功耗 1T1R 802.11n 2.4GHz Wi-Fi 子系统，以及 PMU。单片机为ARM Cortex-M4处理器，支持浮点运算，并且集成 1MB 闪存。请查看比较表格以了解不同智能家庭芯片间的差异。

主要功能

  • 高度集成的射频 + 单片机 + 内存

  • 低功耗的 RTC 模式

  • 主要应用：智能家电、家庭自动化、智能设备、物联网桥接器、连接多重云端服务

MT7682 Product Brief
MT7682 Datasheet
MT7682 Reference Manual

Wi-Fi 子系统支持 1T1R 802.11b/g/n 无线协定、基带和 MAC，含有一个可以完全卸载单片机运算负担的网络处理器，旨在满足低功耗和高输送量的应用程序。


MT7682 支持许多周边接口，包括 UART、I2C、SPI、I2S、PWM、SDIO 和 ADC。

MT7682S chipset block diagram

Features

Wi-Fi

  • IEEE 802.11 b/g/n (2.4GHz, 1x1)

  • Supports 20MHz, 40MHz bandwidth in 2.4GHz band

  • Wi-Fi security WEP/WPA2/WPS

  • SoftAP, sniffer

  • Dynamically switching between STA and SoftAP modes at runtime

  • MediaTek smart connection

  • Multi-cloud connectivity

  • Receiver antenna diversity

  • Integrated Balun, PA/LNA

  • Optional external LNA and PA support

Microcontroller subsystem

  • 192MHz ARM® Cortex®-M4 with FPU

  • 14 DMA channels

  • 1 RTC timer, 1 64-bit and 5 32-bit general purpose timers

  • Hardware DFS from 3MHz to 192MHz

  • Development support: SWD, JTAG

  • Crypto engine including AES, DES, MD5 and SHA-1/224/256/384/512

  • True random number generator

  • JTAG password protection

Memory

  • Up to 384KB SRAM, with zero-wait state and 96MHz maximum frequency

  • Up to 32KB L1 cache, with high hit rate, zero- wait state and 192MHz maximum frequency

  • Embedded 8Mbits flash, with less than 0.1μA (typical) and 80MHz maximum frequency deep power-down current

Communication interfaces

  • 1 SDIO 2.0 master and 1 SDIO 2.0 slave

  • 1 I2C (3.4Mbps) interface

  • 3 UARTs (3Mbps and with hardware flow control)

  • 1 SPI master and 1 SPI slave (both SCKs are up to 48MHz, quad mode)

  • 2 I2S interfaces

  • 5 PWM channels

  • 14 GPIOs (fast IOs, 5V-tolerant)

  • 1 channel 12-bit AUXADC

Power management

  • Integrated DC-DC
  • Power input
    • VRTC: from 1.62V to 3.63V
    • VPMU / VRF: 3.3V (+/-10%)
    • VIO*: 1.8V/2.8V/3.3V (+/-10%)
  • Off mode: <0.5μA
  • Retention mode (with RTC)
    • <2μA (RTC only)
    • ~4.4μA with 8KB RAM sleep mode
  • Deep sleep mode (with external 32kHz clock)
    • 57μA with 0KB RAM sleep mode
    • 89μA with 384KB RAM sleep mode
  • G-band RX power: 59 mA
  • G-band TX power
    • FPA:268 mA at 19 dBm CCK
    • HPA: 203 mA at 16.5 dBm OFDM
  • DTIM interval with 32kHz external clock source and 384KB SRAM
    • DTIM=1: 0.74mA
    • DTIM=3: 0.33mA
  • Ambient temperature from -40°C to 85°C

Note: The power consumption data is measured at 25°C

Clock source

  • 26MHz or 40MHz crystal oscillator

  • 32kHz crystal oscillator or internal 32kHz RC for RTC

Package

  • 5mm x 5mm x 0.9mm 40-pin QFN with 0.4mm lead pitch