LinkIt™ Assist 2502

Overview

MediaTek LinkIt™ Assist 2502 development platform offers device developers a professional environment in which to design and prototype the software and hardware for Wearable and Internet of Things (IoT) devices.


The platform is based around the world’s smallest commercial System-on-Chip (SoC) for Wearable, MediaTek MT2502A. This SoC also works with MediaTek’s energy efficient Wi-Fi and GNSS companion chipsets. This means it’s now easier than ever to create devices that connect to other smart devices or to cloud applications and services directly.

2502 overview

LinkIt Assist 2502 development platform runs on top of the MT2502A and, when used, its companion GNSS and Wi-Fi chipsets, along with LCM CTP, Memory LCD and OLED screen (swappable). The LinkIt firmware is based on an RTOS kernel. On top of this kernel is a set of drivers, middleware and protocol stacks that expose the features of the chipsets and displays to a framework. A runtime environment then exposes features of the framework to a C-based API used to develop software with the LinkIt Assist 2502 SDK 2.0.

Key features

  • A C-based API, to access and control the hardware features of the MT2502A SoC and connected peripheral hardware

  • API calls to update software and firmware, offering the option to implement FOTA for devices

  • Comprehensive communications, media and UI capabilities, with support for:

  • GSM, GPRS and Bluetooth 2.1 and 4.0 (from the MT2502A)
  • Wi-Fi and GNSS (from companion chipsets)
  • MP3/ AAC audio
  • JPEG decode, vector fonts (powered by Etrump) and more

LinkIt Assist 2502

Co-designed with Seeed Studio. This high performance, open source development board incorporates the LinkIt Assist 2502 module combined with modules for high performance Wi-Fi and GNSS. A full set of pin-outs are provided for connecting peripheral hardware and the display is swappable.


This gives you access to a full range of communication and location acquisition features in a single board.

Key features

  • Supports GSM, GPRS, Bluetooth (2.1 SPP and 4.0 GATT profiles), Wi-Fi, GNSS (GPS, GLONASS and BeiDou) and audio out

  • Pin-out for Digital IO, Analog IO, PWM, I2C, SPI, UART and power supply

  • Swappable display modules (square LCM CTP included; round LCM CTP, Memory LCD and OLED display modules planned)

  • Open source hardware reference design, including schematic, layouts and pin details

Downloads


Development board specifications

Category
Feature
Spec
Microcontroller Module
Module Name
Chipset
Core
Clock Speed
AcSiP AI2502S05
MT2502A (Aster)
ARM7EJ-S™
260MHz
Wi-Fi Module
Module Name
Chipset
AcSiP CW01S
MT5931
GPS Module
Module Name
Chipset
AcSiP CW03S
MT3332
PCB Size Dimensions 53 x 53 mm (2.1 x 2.1 inches)
Memory
Flash
RAM
16MB
4MB
Power
Battery Jack
Charger
3.7~4.2V Li-ion battery
Micro USB
Digital IO Pins
Pin Count
Voltage
14
2.8V
Analog Input Pins
Pin Count
Voltage
4
0~2.8V*
PWM Output Pins
Pin Count
Voltage
2
2.8V
External Interrupts
Pin Count
Voltage
4
2.8V
I2C (master only)
Set Count
Speed
1 (SDA, SCL)
100Kbps, 400Kbps, 3.4Mbps
SPI (master only)
Set Count
Speed
1 (MOSI, MISO, SCK)
104Kbps~26Mbps
UART Set Count 1 (Rx, Tx)
UART on USB* Set Count 1
Xadow (Seeed Studio)
Set Count
Speed
Signal 2.8V, Power 3.3V
850/900/1800/1900 MHz
Communications
GSM
GPRS
Bluetooth
Wi-Fi
850/900/1800/1900 MHz
Class 12
2.1 SPP and 4.0 GATT (Dual Mode)
802.11 b/g/n
Positioning GNSS GPS/GLONASS/BeiDou
Display Module
LCD
Driving IC
Truly 240x240 Transflective
ST7789S

LinkIt Assist 2502 Module

Designed by AcSiP, theses module include:


  • LinkIt Assist 2502 module (containing the MediaTek MT2502, delivered as AcSiP module AI2502S05)
  • LinkIt Assist 2502 Wi-Fi module (containing the MediaTek MT5931, delivered as AcSiP module CW01S)
  • LinkIt Assist 2502 GNSS module (containing the MediaTek MT3332, delivered as AcSiP module CW03S)

These modules are designed to be incorporated into the PCB design of final products.

Downloads


Module specifications

Category
Feature
Spec
Microcontroller (MCU)
Chipset
Core
Clock Speed
MT2502A
ARM7EJ-S™
260MHz
Module Size
Package
17mm x 15mm x 1.8mm
LGA
Operating limits
Temperature
Humidity
-20℃~ 70℃
10 ~ 95% (Non-Condensing)
Storage
Temperature
Humidity
-40℃~ 85℃
5 ~ 95% (Non-Condensing)
Memory
Flash
RAM
16Mb
4Mb
Power Operating voltage 3.4~4.2V
Digital IO Pins
Pin Count
Voltage
TDB
3.3V
Analog IO Pins
Pin Count
Voltage
5
TBD
0~5V
PWM Output Pins
Pin Count
Maximum Resolution
2
13bit@1.6kHz
8bit@50.8kHz
4bit@800kHz
I2C (master only) Operating frequencies
100Kbps
400Kbps
3.4Mbps
SPI (master only) Operating frequencies 104Kbps~26Mbps
GSM/GPRS Operating frequencies 850/900/1800/1900MHz
Bluetooth
Bluetooth 2.1
Bluetooth 4.0
(Dual mode)

Chipset

MT2502A

The hardware core for LinkIt ONE development platform is MediaTek MT2502A.


The MediaTek MT2502A is a feature-rich and extremely powerful single-chip solution for high-end GSM/GPRS (2G) capabilities. It also features a highly integrated Bluetooth transceiver which is fully compliant with Bluetooth specification v4.0.


This chipset also works with our Wi-Fi(MT5931) and GNSS(MT3332) chips, offering high performance and low power consumption for Wearable and IoT devices.

SDK

The LinkIt Assist 2502 SDK 2.0 provides a plug-in for Eclipse IDE (with CDT) to enable software coding, and includes tools to update firmware on and upload software to the LinkIt Assist 2502 development board.

Key features

  • C API runtime environment

  • Compiles projects into LinkIt Assist 2502 execution file format (.vxp)

  • LinkIt Assist 2502 API libraries provide communication functions for:

  • TCP sockets
  • HTTPS
  • Bluetooth 4.0 GATT and more
  • User interface through LCM display module with support for vector fonts (powered by etrump), graphics, compression, and more

  • Compatible with Eclipse IDE (Indigo) with CDT plug-in (8.0.2 or later)

  • Supports Microsoft Windows XP, Vista, 7 and 8

Note

Software developed with the LinkIt Assist 2502 SDK can also run on the LinkIt ONE development board with some limitations, see the MediaTek LinkIt Assist 2502 Developer’s Guide for more details.