MediaTek MT2533D is a highly integrated chipset designed to support the creation of Bluetooth wireless headphones, headsets and earpieces, as well as various hands-free systems.


  • Highly integrated with RF, MCU and memory

  • Low power mode with RTC

  • Supports multiple frequency modes to offer improved and extended battery life, while maintaining high performance

  • Fast 7µs wakeup from sleep mode to active mode

Key Features

  • ARM Cortex-M4 processor with floating point unit, offering low power consumption features such as multiple frequency and voltage modes and use of TSMC 55nm ultra-low power technology. Support for high voltage batteries also helps extend time between charges. Memory consisting of 4MB PSRAM and 4MB flash is also provided.

  • Bluetooth subsystem (radio, baseband and link controller) supporting dual-mode Bluetooth 2.1 and Bluetooth 4.2 Low Energy, enabling devices to connect to a wide range of current and legacy smartphones and other personal devices.

  • Audio Analog Front End (AFE) combined with Cadence® Tensilica® HiFi Mini Digital Signal Processor (DSP), a small, low power DSP for always-listening voice trigger and voice recognition applications. The DSP supports A2DP, SBC, MP3 and AAC (256kbps) codecs, dual microphone with native Dual Microphone Noise Reduction (DMNR) technology and speech enhancement features including support for third-party voice-based wake-up software.

  • Support for 4GB of eMMC external storage, through the SDIO interface. This enables devices to store up to 1000 music tracks and take advantage of the local MP3 playback.

  • The display component supports MIPI-DSI and serial interfaces. It includes 2D capabilities of true color, per pixel alpha channel and anti-aliasing fonts, plus 1-bit index color to save memory and computing power. The camera component supports DDR mode with a maximum clock rate of 48MHz, up to VGA.

  • Comprehensive range of interfaces including UART, I2C, SPI, I2S, PWM, SDIO, MSDC, USB, PCMIF, ADC and dual digital MIC.

MT2533D block diagram


  • 208MHz ARM® Cortex®-M4 processor with FPU

  • Hardware DFS from 26MHz to 208MHz

  • 17 DMA channels

  • Crypto engine AES 128/192/256 bits

  • True random number generator

  • Operating temperature from -40°C to 85°C


  • 160kB SRAM with zero-wait state and 208MHz maximum frequency

  • 32kB L1 cache with zero-wait state and 208MHz maximum frequency

  • 4MB flash with sleep current down to 100nA and 78MHz maximum frequency

  • 4MB pseudo SRAM with sleep current down to 10µA and 104MHz maximum frequency


  • USB 2.0, 3 UARTs, 3 I2Cs, I2S, 6 PWMs, 4 SPI masters, SPI slave, SDIO v2.0 and 5-channel ADC

  • Supports 38 GPIO ports


  • Bluetooth specification 4.2

  • Dual mode (Bluetooth and Bluetooth LE)

  • Integrated T/R switch, Balun and PA

  • PA provides 7.5dBm output power

  • Bluetooth and Bluetooth LE receiver sensitivity of -93dBm and -96.5dBm, respectively

  • Up to 7 simultaneous active ACL links

  • 1 SCO or eSCO link with CVSD/mSBC coding


  • AAC/SBC for Bluetooth audio

  • CVSD/mSBC for Bluetooth speech

  • PCM playback: 8-48kHz sample rate

  • PCM record: 8kHz and 16kHz sample rates

  • Dual-mic noise suppression and acoustic echo cancellation

  • Beamforming


  • Hardware 2D accelerator supporting 4-layer overlay, alpha blending, font drawing, 7 types of rotation bitblit and display rotation. It also supports ARGB8888, RGB888, RGB565 and ARGB6666 pixel formats

  • DBI serial interface supporting 320 x 320 pixels at 30fps

  • 1-lane MIPI DSI interface supporting 480 x 320 pixels at 30fps


  • MediaTek camera serial interface

  • VGA at 30fps with YUV422 or RGB565

Technology and package

  • Highly integrated SiP technology

  • 6.2 x 5.8 x 1.05 mm 172-ball TFBGA with 0.4mm pitch