MT2523

Overview

MediaTek MT2523 product family (MT2523D/MT2523G) is based around a highly integrated system in package (SiP) design that contains a micro controller unit, a low power GNSS chip (MT2523G), dual mode Bluetooth, and a power management unit (PMU). The micro controller unit is an ARM Cortex-M4F MCU with integrated 4MB PSRAM and 4MB flash memory. MT2523 also supports interfaces such as UART, I2C, SPI, I2S, PWM, SDIO, MSDC, USB, PCMIF, ADC and dual digital MIC.

Key features

  • High integration with RF+MCU+Memory

  • Low power mode with RTC

  • Supports multiple frequency and voltage modes to achieve an improved and extended battery life while maintaining high performance

  • Fast switching time from sleep mode to active mode under 10μs

The GNSS companion chip is a multi-GNSS RF SoC aimed to achieve the industry’s highest level of sensitivity, accuracy and Time-to-First-Fix (TTFF) with lowest power consumption. It supports various location and navigation applications, including autonomous GPS, GLONASS, GALILEO, BEIDOU, SBAS ranging (WAAS, EGNOS, GAGAN, and MSAS), QZSS, DGPS (RTCM) and Assisted GPS (A-GPS). It also includes up to 12 multi-tone active interference cancellers.


The Bluetooth subsystem supports Bluetooth 2.1 and Bluetooth 4.2 Low Energy (dual mode). It contains the Bluetooth radio, baseband and link controller.


The display component supports MIPI-DSI and serial interfaces. It includes 2D capabilities of true color, per pixel alpha channel and anti-aliasing fonts, plus 1-bit index color to save memory and computing power. The camera component supports DDR mode with a maximum clock rate of 48MHz, up to VGA.

MT2523 chipset block diagram

Platform

  • ARM Cortex-M4 MCU with FPU

  • Embedded 4MB memory + 160KB SRAM and 4MB flash

  • 25 DMA channels

  • Low power RTC mode with 32 kHz crystal support

  • Dual mode Bluetooth and Bluetooth Low Energy, large TX power and excellent RX sensitivity for best coverage

  • Supports high battery voltage (4.8V) for extended battery life

  • Multiple frequency and voltage modes for low power and computing power balance: High speed (1.3V, 208MHz), Full speed (1.1V, 104MHz), Low speed (0.9V, 26MHz)

  • Low power crystal oscillator clock sources down to 40μA

Connectivity

  • UART, I2C, SPI, I2S, PWM, SDIO, MSDC, USB, PCMIF, ADC, and dual digital MIC

GNSS (2523G only)

  • GPS/GLONASS/GALILEO/BEIDOU

  • Supports multi-GNSS including QZSS and SBAS ranging

  • Supports WAAS/EGNOS/MSAS/GAGAN

  • 12 multi-tone active interference cancellers (with ISSCC2011 award)

  • RTCM ready

  • Indoor and outdoor multi-path detection and compensation

  • Supports FCC E911 compliance and A-GPS

  • Maximum fixed update rate up to 10 Hz

Bluetooth

  • Bluetooth specification 2.1+EDR

  • Bluetooth 4.2 Low Energy (LE)

  • Integrated BALUN and PA

  • Scatternet support: Up to 7 piconets simultaneously with background inquiry /page scan

  • Up to 7 simultaneous active ACL links

  • Supports SCO and eSCO links with re-transmission

  • Channel quality driven data rate adaptation

  • Channel assessment for AFH

Display

  • DBI interface: Simultaneous connection to 2 serial LCD modules and maximum resolution up to 320 x 320

  • DSI interface: Supports sync-event, sync-pulse, and burst mode video modes, plus ultra-low power mode with low frame-rate (LFR) technique and high-speed mode with 500 Mbps

Technology and package

  • Highly integrated 55nm ultra low power technology

  • 6.2mm x 5.8mm 165-ball VFBGA package with SiP Serial Flash and PSRAM for MT2523D

  • 9.2mm x 6mm 242-ball VFBGA package with SiP Serial Flash, PSRAM and GNSS for MT2523G

LinkIt 2523

The LinkIt 2523 HDK is a fully functional demonstration board for IoT and Wearable applications powered by MediaTek MT2523G, an ARM Cortex-M4 core-based microcontroller unit (MCU). It enables rich connectivity features, communication with cloud services and real-time control. LinkIt 2523 HDK supports development on Keil IDE and provides additional libraries to integrate a variety of peripherals that enables a new class of highly connected applications.